Package Materials Encapsulating Resin Materials Electrodes Materials Weight Heat-Resistant Polymer （+） Silicone Resin (with diffuser and phosphor) + Ag-plated Copper Alloy 0.0074g(TYP) * 。 Dimensions do not include mold flash. KA Protectio.

NFSW172AT

NFSW036ALT

NFSW036AT

NFSW036BT

NFSW036CT

NFSW036LT

NFSW036T

NFSW072T

NFSW385AT

NFSW757GT

NFS110-7601J

NFS110-7601PJ

NFS110-7602J

Since 2006. D4U Semicon.   |   Contact Us   |   Privacy Policy   |   Purchase of parts