Package Materials Encapsulating Resin Materials Electrodes Materials Weight Heat-Resistant Polymer （+） Silicone Resin (with diffuser and phosphor) + Ag-plated Copper Alloy 0.018g(TYP) * 。 Dimensions do not include mold flash. * a>b、a。 The si.

NF2W757GT-F1

NF2W757DRT-V1M2

NF2W757DRT-V1M3

NF2W385ART

NF2W557BRT

NF2000A-RQ

NF2000A-YX

NF2000A-YXH

NF2000C-RQ

NF2000H-B

NF2000H-WP

NF2001H-B

NF2002-VA10A

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