Ceramics （） Hard Glass (with phosphor) Encapsulating Resin Materials Silicone Resin Electrodes Materials Weight Au-plated 0.022g(TYP) * 。 Dimensions do not include mold flash. KA Protection Device 4 SOLDERING
* Reflow Soldering Co.

NC302L

NC303

NC303SOT

NC305

NC33395T

NC38

NC3MP

NC3MP-B

NC3SFN-6035-CVC

NC01520

NC0805Kxxxx

NC101

NC102

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