Ceramics （） Hard Glass (with phosphor) Encapsulating Resin Materials Silicone Resin Electrodes Materials Weight Au-plated 0.011g(TYP) * 。 Dimensions do not include mold flash. Protection Device 4 SOLDERING
* Reflow Soldering Condi.

NC201

NC202

NC203

NC2090C

NC26

NC2D-AC100V

NC2D-AC12V

NC2D-AC24V

NC2D-AC48V

NC2D-DC100V

NC2D-DC110V

NC2D-DC12V

NC2D-DC24V

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