< Dual-In-Line Package Intelligent Power Module >
PSS30S92F6-AG, PSS30S92E6-AG
TRANSFER MOLDING TYPE
INSULATED TYPE
MAXIMUM RATINGS (Tj = 25°C, unless otherwise noted)
INVERTER PART
Symbol
Parameter
Condition
Ratings
Unit
VCC Supply voltage
Applied between P-NU,NV,NW
450 V
VCC(surge) Supply voltage (surge)
Applied between P-NU,NV,NW
500 V
VCES
Collector-emitter voltage
600 V
±IC Each IGBT collector current
TC= 25°C
30 A
±ICP Each IGBT collector current (peak) TC= 25°C, less than 1ms
60 A
PC Collector dissipation
TC= 25°C, per 1 chip
47.6 W
Tj Junction temperature
(Note 1)
-30~+150
°C
Note1: The maximum junction temperature rating of built-in power chips is 150°C(@Tc≤100°C).However, to ensure safe operation of DIPIPM, the average
junction temperature should be limited to Tj(Ave)≤125°C (@Tc≤100°C).
CONTROL (PROTECTION) PART
Symbol
Parameter
VD Control supply voltage
VDB Control supply voltage
VIN Input voltage
VFO Fault output supply voltage
IFO Fault output current
VSC Current sensing input voltage
Condition
Applied between VP1-VNC, VN1-VNC
Applied between VUFB-U, VVFB-V, VWFB-W
Applied between UP, VP, WP-VPC, UN, VN, WN-VNC
Applied between FO-VNC
Sink current at FO terminal
Applied between CIN-VNC
Ratings
20
20
-0.5~VD+0.5
-0.5~VD+0.5
1
-0.5~VD+0.5
Unit
V
V
V
V
mA
V
TOTAL SYSTEM
Symbol
Parameter
VCC(PROT)
Self protection supply voltage limit
(Short circuit protection capability)
TC Module case operation temperature
Tstg Storage temperature
Viso Isolation voltage
Fig. 1: TC MEASUREMENT POINT
Condition
VD = 13.5~16.5V, Inverter Part
Tj = 125°C, non-repetitive, less than 2μs
Measurement point of Tc is provided in Fig.1
60Hz, Sinusoidal, AC 1min, between connected all pins
and heat sink plate
Ratings
400
-30~+100
-40~+125
1500
Unit
V
°C
°C
Vrms
Control terminals
DIPIPM
11.6mm
3mm
IGBT chip position
Power terminals
Tc point
Heat sink side
THERMAL RESISTANCE
Symbol
Parameter
Condition
Min.
Limits
Typ.
Max.
Unit
Rth(j-c)Q
Junction to case thermal
Inverter IGBT part (per 1/6 module)
- - 2.1 K/W
Rth(j-c)F
resistance
(Note 2)
Inverter FWDi part (per 1/6 module)
- - 3.0 K/W
Note 2: Grease with good thermal conductivity and long-term endurance should be applied evenly with about +100μm~+200μm on the contacting surface of
DIPIPM and heat sink. The contacting thermal resistance between DIPIPM case and heat sink Rth(c-f) is determined by the thickness and the thermal
conductivity of the applied grease. For reference, Rth(c-f) is about 0.3K/W (per 1/6 module, grease thickness: 20μm, thermal conductivity: 1.0W/m•k).
Publication Date : December 2013
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