Absolute Maximum Ratings (Note 1)
Supply Voltage (VCC) ........................................................... 22 V
Logic Input Voltage ............................................................... 7 V
Source/Sink Output Current (Each Output)
Continuous ................................................................... ±0.5 A
Pulse, 500 ns ................................................................ ±3.0 A
Note 1.
Exceeding these ratings could cause damage to the device.
All voltages are with respect to ground.
All currents are positive into the specified terminal.
Operating Junction Temperature
Hermetic (T, Y - Packages) ........................................ 150°C
Plastic (M, DW, L- Packages) .......................................150°C
Storage Temperature Range ............................ -65°C to 150°C
Lead Temperature (Soldering, 10 s) .............................. 300°C
RoHS Peak Package Solder Reflow Temp. (40 s max. exp.).......... 260°C (+0, -5)
Thermal Data
Y Package:
Thermal Resistance-Junction to Case, θJC .................. 50°C/W
Thermal Resistance-Junction to Ambient, θJA ............ 130°C/W
M Package:
Thermal Resistance-Junction to Case, θJC .................. 60°C/W
Thermal Resistance-Junction to Ambient, θJA ............. 95°C/W
DW Package:
Thermal Resistance-Junction to Case, θJC .................. 40°C/W
Thermal Resistance-Junction to Ambient, θJA .............. 95°C/W
T Package:
Thermal Resistance-Junction to Case, θJC .................. 25°C/W
Thermal Resistance-Junction to Ambient, θJA ........... 130°C/W
L Package:
Thermal Resistance-Junction to Case, θJC .................. 35°C/W
Thermal Resistance-Junction to Ambient, θJA ........... 120°C/W
Note A. Junction Temperature Calculation: TJ = TA + (PD x θJA).
Note B. The above numbers for θJC are maximums for the limiting
thermal resistance of the package in a standard mounting
configuration. The θJA numbers are meant to be guidelines for
the thermal performance of the device/pc-board system. All of
the above assume no ambient airflow.
Recommended Operating Conditions (Note 2)
Supply Voltage (VCC) .................................4. .5 V to 20 V (Note 3)
Frequency Range ........................................... DC to 1.5 MHz
Peak Pulse Current ............................................................ ±3 A
Logic Input Voltage ................................................ -0.5 to 5.5 V
Operating Ambient Temperature Range (TJ)
SG1626 ......................................................... -55°C to 125°C
SG2626 ........................................................... -25°C to 85°C
SG3626 .............................................................. 0°C to 70°C
Note 2. Range over which the device is functional.
Note 3. AC performance has been optimized for VCC = 8 V to 20 V.
Electrical Characteristics
(Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG1626 with
-55°C ≤ TA ≤ 125°C, SG2626 with - 25°C ≤ TA ≤ 85°C, SG3626 with 0°C ≤ TA ≤ 70°C, and VCC = 20 V. Low duty cycle pulse
testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.)
Parameter
Static Characteristics
Logic 1 Input Voltage
Logic 0 Input Voltage
Input High Current
Input High Current
Input Low Current
Input Clamp Voltage
Output High Voltage (Note 4)
Output Low Voltage (Note 4)
Supply Current Outputs Low
Supply Current Outputs High
Note 4. VCC = 10 V to 20 V.
Test Conditions
VIN = 2.4 V
VIN = 5.5 V
VIN = 0 V
IIN = -10 mA
IOUT = -200 mA
IOUT = 200 mA
VIN = 2.4 V (both inputs)
VIN = 0 V (both inputs)
SG1626/2626/3626
Min. Typ. Max.
Units
2.0
VCC-3
18
7.5
0.7
500
1.0
-4
-1.5
1.0
27
12
V
V
µA
mA
mA
V
V
V
mA
mA
2
