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  Microsemi Electronic Components Datasheet  

SG3626 Datasheet

Dual High Speed Driver

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SG1626/SG2626/SG3626
Dual High Speed Driver
Description
The SG1626 series is a dual inverting monolithic high speed
driver that is pin-to-pin compatible with the DS0026,
TSC426 and ICL7667. This device utilizes high voltage
Schottky logic to convert TTL signals to high speed outputs
up to 18 V. The totem pole outputs have 3 A peak current
capability, which enables them to drive 1000 pF loads in
typically less than 25 ns. These speeds make it ideal for
driving power MOSFETs and other large capacitive loads
requiring high speed switching.
In addition to the standard packages, the 16-pin SOIC (DW-
package) is available for commercial and industrial
applications. These packages offer improved thermal
performance for applications requiring high frequencies and/
or high peak currents.
Features
Pin-to-Pin Compatible with DS0026, TSC426
and ICL7667.
Totem Pole Outputs with 3.0 A Peak
Current Capability.
Supply Voltage to 22 V.
Rise and Fall times less than 25 ns.
Propagation Delays less than 20 ns.
Inverting High-Speed High-Voltage Schottky Logic.
Efficient Operation at High Frequency.
Available in:
8 - Pin Plastic and Ceramic DIP
16 - Pin Plastic SOIC
8 - Pin TO-99
20 - Pin Ceramic LCC
High Reliability Features
Available to MIL-STD-883, ¶ 1.2.1
MSC-AMS level “S” Processing Available
Block Diagram
VCC
6.5 V
VREG
2.5 k
3k
INV. INPUT
OUTPUT
June 2015 Rev. 1.2
www.microsemi.com
© 2015 Microsemi Corporation
GND
1


  Microsemi Electronic Components Datasheet  

SG3626 Datasheet

Dual High Speed Driver

No Preview Available !

Absolute Maximum Ratings (Note 1)
Supply Voltage (VCC) ........................................................... 22 V
Logic Input Voltage ............................................................... 7 V
Source/Sink Output Current (Each Output)
Continuous ................................................................... ±0.5 A
Pulse, 500 ns ................................................................ ±3.0 A
Note 1.
Exceeding these ratings could cause damage to the device.
All voltages are with respect to ground.
All currents are positive into the specified terminal.
Operating Junction Temperature
Hermetic (T, Y - Packages) ........................................ 150°C
Plastic (M, DW, L- Packages) .......................................150°C
Storage Temperature Range ............................ -65°C to 150°C
Lead Temperature (Soldering, 10 s) .............................. 300°C
RoHS Peak Package Solder Reflow Temp. (40 s max. exp.).......... 260°C (+0, -5)
Thermal Data
Y Package:
Thermal Resistance-Junction to Case, θJC .................. 50°C/W
Thermal Resistance-Junction to Ambient, θJA ............ 130°C/W
M Package:
Thermal Resistance-Junction to Case, θJC .................. 60°C/W
Thermal Resistance-Junction to Ambient, θJA ............. 95°C/W
DW Package:
Thermal Resistance-Junction to Case, θJC .................. 40°C/W
Thermal Resistance-Junction to Ambient, θJA .............. 95°C/W
T Package:
Thermal Resistance-Junction to Case, θJC .................. 25°C/W
Thermal Resistance-Junction to Ambient, θJA ........... 130°C/W
L Package:
Thermal Resistance-Junction to Case, θJC .................. 35°C/W
Thermal Resistance-Junction to Ambient, θJA ........... 120°C/W
Note A. Junction Temperature Calculation: TJ = TA + (PD x θJA).
Note B. The above numbers for θJC are maximums for the limiting
thermal resistance of the package in a standard mounting
configuration. The θJA numbers are meant to be guidelines for
the thermal performance of the device/pc-board system. All of
the above assume no ambient airflow.
Recommended Operating Conditions (Note 2)
Supply Voltage (VCC) .................................4. .5 V to 20 V (Note 3)
Frequency Range ........................................... DC to 1.5 MHz
Peak Pulse Current ............................................................ ±3 A
Logic Input Voltage ................................................ -0.5 to 5.5 V
Operating Ambient Temperature Range (TJ)
SG1626 ......................................................... -55°C to 125°C
SG2626 ........................................................... -25°C to 85°C
SG3626 .............................................................. 0°C to 70°C
Note 2. Range over which the device is functional.
Note 3. AC performance has been optimized for VCC = 8 V to 20 V.
Electrical Characteristics
(Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG1626 with
-55°C TA 125°C, SG2626 with - 25°C TA 85°C, SG3626 with 0°C TA 70°C, and VCC = 20 V. Low duty cycle pulse
testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.)
Parameter
Static Characteristics
Logic 1 Input Voltage
Logic 0 Input Voltage
Input High Current
Input High Current
Input Low Current
Input Clamp Voltage
Output High Voltage (Note 4)
Output Low Voltage (Note 4)
Supply Current Outputs Low
Supply Current Outputs High
Note 4. VCC = 10 V to 20 V.
Test Conditions
VIN = 2.4 V
VIN = 5.5 V
VIN = 0 V
IIN = -10 mA
IOUT = -200 mA
IOUT = 200 mA
VIN = 2.4 V (both inputs)
VIN = 0 V (both inputs)
SG1626/2626/3626
Min. Typ. Max.
Units
2.0
VCC-3
18
7.5
0.7
500
1.0
-4
-1.5
1.0
27
12
V
V
µA
mA
mA
V
V
V
mA
mA
2


Part Number SG3626
Description Dual High Speed Driver
Maker Microsemi
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SG3626 Datasheet PDF






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