MPC8200 Overview
KEY FEATURES Low parasitics LP = 0.02nH Typical CP = 0.04pF Typical Surface Mount design Broadband Performance through X-Band Available on Tape & Reel for automated pick & place assembly Small, SOD 323 Footprint This series of surface mount capacitors utilize new and unique monolithic MMSM® technology. The technology is a package/device integration acplished at the wafer fabrication level. Since interconnections...
MPC8200 Key Features
- Low parasitics LP = 0.02nH Typical CP = 0.04pF Typical
- Surface Mount design
- Broadband Performance through X-Band
- Available on Tape & Reel for automated pick & place assembly
- Small, SOD 323 Footprint