MPC8020 Datasheet | Microsemi

DESCRIPTION KEY FEATURES - Low parasitics LP = 0.02n H Typical CP = 0.04p F Typical - Surface Mount design - Broadband Performance through X-Band - Available on Tape & Reel for automated pick & place assembly - Small, SOD 323 Footprint This series of surface mount capacitors utilize new and unique monolithic MMSM® technology. The technology is a package/device integration acplished at the wafer fabrication level. Since interconnections utilize precision photolithographic techniques rather than wire bonds, parasitic package inductance is tightly controlled. The package parasitics provide smooth non-resonant functionality through X Band. Microsemi utilizes high quality dielectric materials resulting in exceptional Quali ty Factor (Q) and lowest loss. Insertion loss is typically less than 0.2 db over the working frequency range. This series of devices meets Ro HS requirements per EU Directive 2002/95/EC. .MICROSEMI. APPLICATIONS - Ro HS pliant The MPC8000 MMSM® capacitors are used in RF circ uits for dc blocks, capacitive coupling and RF bypass. They are used for fixed capacitive tuning of oscillators, multipliers or filter elements. 1- These devices are supplied with gold terminations. APPLICATIONS/BENEFIT S - DC Blocks - Capacitive coupling - RF Bypass - Fixed Filter Elements ABSOLUTE MAXIMUM RATINGS AT 25º C (UNLESS OTHERWISE SPECIFIED) Rating Maximum Leakage Current @80% of minimum Rated V B Operating Temperature Storage Temperature Symbol IR TOP TSTG Value 10 -55 to +125 -55 to +125 Unit n A ºC ºC IMPORTANT: For the most current data, consult our website: .MICROSEMI. Specifications are subject to change. Consult factory for latest information . MPC8010 - MPC8300 These devices are ESD sensitive and must be handled using ESD precautions. Copyright  2007 Rev. 2010-02-03 Microsemi - RFIS 75 Technology Drive, Lowell, MA. 01851, 978 -442-5600, Fax: 978-937-3748 Page 1 MPC8010-MPC8300 TM ® PASSIVE DEVICES - MMSM® Capacitors Ro HS PLIANT .. . DEVICE...