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LX3055 - Coplanar InGaAs/InP PIN Photo Diode

Description

KEY

Features

  • Microsemi’s InGaAs/InP PIN custom assembly configurations.
  • LX3055 single die Photo Diode chips are ideal for high including traditional wirebond or flip.
  • Coplanar Waveguide , 50Ω bandwidth 1310nm and 1550nm chip assembly.
  • High Responsivity optical networking.

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WWW.Microsemi .COM Obsolete Product – not recommended for new design LX3055 TM ® Coplanar InGaAs/InP PIN Photo Diode PRODUCTION DATA SHEET DESCRIPTION KEY FEATURES Microsemi’s InGaAs/InP PIN custom assembly configurations ƒ LX3055 single die Photo Diode chips are ideal for high including traditional wirebond or flip ƒ Coplanar Waveguide , 50Ω bandwidth 1310nm and 1550nm chip assembly ƒ High Responsivity optical networking applications. This device is ideal for ƒ Low Dark Current The device series offers high manufacturers of optical receivers, responsivity, low dark current, and transponders, optical transmission high bandwidth for high performance modules and combination PIN photo and low sensitivity receiver design. diode – transimpedance amplifier.