Datasheet4U Logo Datasheet4U.com

EDI88512CA-XMXG - 512Kx8 Plastic Monolithic SRAM CMOS

Description

I/O0-7 A0-18 WE# CS# OE# VCC VSS NC Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power (+5V ±10%) Ground Not Connected BLOCK DIAGRAM Memory Array Address Buffer Address Decoder I/O Circuits I/OØ-7 Microsemi Corporation (602) 437-1520 www.mi

Features

  •  512Kx8 bit CMOS Static.
  •  Random Access Memory.
  • Access Times of 17, 20, 25ns.
  • Data Retention Function (LPA version).
  • Extended Temperature Testing.
  • Data Retention Functionality Testing.
  •  36 lead JEDEC Approved Revolutionary Pinout.
  • Plastic SOJ (Package 319).
  •  Single +5V (±10%) Supply Operation.
  •  RoHS compliant WEDC's ruggedized plastic 512Kx8 SRAM that allows the user to capitalize on the cost advantage of using a plastic com.

📥 Download Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
EDI88512CA 512Kx8 Monolithic SRAM/ SMD 5962-95600 ETC
EDI8808CA35 High Speed 64K Monolithic SRAM EDI
EDI8808CA45 High Speed 64K Monolithic SRAM EDI
EDI8808CA55 High Speed 64K Monolithic SRAM EDI
EDI8808CA70 High Speed 64K Monolithic SRAM EDI

Other Datasheets by Microsemi (Microchip)

Part Number Description
EDI88512CA 512Kx8 Monolithic SRAM
EDI88512C 512Kx8 Monolithic SRAM
EDI816256CA 256K x 16 Monolithic SRAM

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
EDI88512CA-XMXG WPS512K8X-XRJXG 512Kx8 Plastic Monolithic SRAM CMOS FEATURES  512Kx8 bit CMOS Static  Random Access Memory • Access Times of 17, 20, 25ns • Data Retention Function (LPA version) • Extended Temperature Testing • Data Retention Functionality Testing  36 lead JEDEC Approved Revolutionary Pinout • Plastic SOJ (Package 319)  Single +5V (±10%) Supply Operation  RoHS compliant WEDC's ruggedized plastic 512Kx8 SRAM that allows the user to capitalize on the cost advantage of using a plastic component while not sacrificing all of the reliability available in a full military device. Extended temperature testing is performed with the test patterns developed for use on WEDC’s fully compliant 512Kx8 SRAMs.
Published: |