Datasheet4U Logo Datasheet4U.com

MT29F1G01AAADD - 1Gb x1: SPI NAND Flash Memory

Description

6 Architecture 7 Ball Assignments and Descriptions 8 Memory Mapping 10 Array Organization 10 Bus Operation 11 SPI Modes 11 CS# 11 SCK 11 HOLD#/SO3 11 SI/SO0 12 WP#/SO2 12 SO/SO1 12 SPI NAND Command Definitions 13 WRITE Operations 14 WRITE ENABLE (06h) 14 WRITE DISABLE (04h) 14 Featu

Features

  • NAND Flash Memory Serial Peripheral Interface (SPI) MT29F1G01AAADD Features.
  • Single-level cell (SLC) technology.
  • Organization.
  • Page size x1: 2112 bytes (2048 + 64 bytes).
  • Block size: 64 pages (128K + 4K bytes).
  • Plane size: 2 planes x 512 blocks per plane.
  • Device size: 1Gb: 1024 blocks.
  • Data retention: 10 years.
  • New commands.
  • PAGE READ in x2 mode.
  • PAGE READ in x4 mode Options.
  • Density: 1Gb (single.

📥 Download Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
MT29F1GxxABB 1Gb NAND Flash Memory Micron
MT29F128G08AJAAA NAND Flash Memory Micron
MT29F128G08AKAAA NAND Flash Memory Micron
MT29F128G08AKCAB NAND Flash Memory Micron
MT29F128G08AMAAA NAND Flash Memory Micron

Other Datasheets by Micron Technology

Part Number Description
MT29F1G08AACH4 NAND Flash Memory
MT29F1G08AACWP NAND Flash Memory
MT29F1G08ABADAH4 NAND Flash Memory
MT29F1G08ABADAWP NAND Flash Memory
MT29F1G08ABAEAH4 NAND Flash Memory

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
Micron Confidential and Proprietary Advance‡ 1Gb x1: SPI NAND Flash Memory Features NAND Flash Memory Serial Peripheral Interface (SPI) MT29F1G01AAADD Features • Single-level cell (SLC) technology • Organization – Page size x1: 2112 bytes (2048 + 64 bytes) – Block size: 64 pages (128K + 4K bytes) – Plane size: 2 planes x 512 blocks per plane – Device size: 1Gb: 1024 blocks • Data retention: 10 years • New commands – PAGE READ in x2 mode – PAGE READ in x4 mode Options • Density: 1Gb (single die) • Operating temperature – Commercial (0°C to +70°C) – Industrial (–40°C to +85°C) • Package – 63-ball VFBGA, lead-free, (9mm x 11mm) Table 1: NAND Flash SPI Parameters Parameters VCC range Frequency Transfer rate Loading throughput tBERS (BLOCK ERASE) tPROG (PAGE PROGRAM) tRD (PAGE READ) Inter
Published: |