NAND Flash and Mobile LPDRAM 152-Ball Package-on-Package (PoP) Combination Memory (TI OMAP™) MT29C Family Current production part numbers: See Table 1 on page 3 Feature.

with low-power, high-performance, and minimal package-footprint design requirements. The NAND Flash and Mobile LPDRAM de.

General Description Micron package-on-package (PoP) products combine NAND Flash and Mobile LPDRAM devices in a single MCP. These products target mobile applications with low-power, high-performance, and minimal package-footprint design requirements..

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