W82M32V-XBX - 2M x 32 SRAM 3.3V MULTI-CHIP PACKAGE

Features

•  Access Times of 12, 15, 17, 20ns.
•  Packaging.
• 255 PBGA, 25mm x 25mm, 625mm2.
•  Organized as 2Mx32.
•  Commercial, Industrial and Military Temperature Ranges.
•  Low Voltage Operation:.
• 3.3V ± 10% Power Supply.
•  Low Power CMOS.
•  TTL Compatible Inputs and Outputs.
•  Fully Static Operation:.
• No clock or refresh required.
•  Three State Output.
• This product is subject to change without notice. 1 A B NC C NC D NC E NC F NC G N.