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Maxim Integrated Semiconductor Electronic Components Datasheet

MAX16813 Datasheet

High-Brightness LED Driver

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MAX16813
EVALUATION KIT AVAILABLE
Integrated, 4-Channel, High-Brightness
LED Driver with High-Voltage DC-DC Controller
and Battery Disconnect
General Description
The MAX16813 high-efficiency, high-brightness LED (HB
LED) driver provides four integrated LED current-sink
channels. An integrated current-mode switching control-
ler drives a DC-DC converter that provides the neces-
sary voltage to multiple strings of HB LEDs. The device
accepts a wide 4.75V to 40V input voltage range and
withstands direct automotive load-dump events. The
wide input range allows powering HB LEDs for small- to
medium-sized LCD displays in automotive and general
lighting applications.
An internal current-mode switching DC-DC controller
supports boost or SEPIC topologies and operates in an
adjustable frequency range between 200kHz and 2MHz.
An integrated spread-spectrum mode helps reduce EMI.
Current-mode control with programmable slope compen-
sation provides fast response and simplifies loop compen-
sation. An adaptive output-voltage control scheme mini-
mizes power dissipation in the LED current-sink paths.
The device has a separate p-channel drive (PGATE) pin
that is used for output undervoltage protection. Whenever
the output falls below the threshold, the external
p-MOSFET is latched off, disconnecting the input source.
Cycling the EN or the input supply is required to restart
the converter. The external p-MOSFET is off when the EN
pin is below 0.3V (typ). The shutdown current is 1µA (typ)
at an input voltage of 12V.
The device consists of four identical linear current-sink
channels, adjustable from 20mA to 150mA with an
accuracy of ±3% using a single external resistor. Multiple
channels can be connected in parallel to achieve higher
current per LED string. The device also features a unique
pulsed dimming control through a logic input (DIM),
with minimum pulse width as low as 500ns. Protection
features include output overvoltage, open-LED detection
and protection, programmable shorted LED detection and
protection, output undervoltage protection and detection,
and overtemperature protection. The device operates
over the -40°C to +125°C automotive temperature range.
The MAX16813 is available in 20-pin (6.5mm x 4.4mm)
TSSOP and 20-pin (4mm x 4mm) TQFN packages.
Benefits and Features
● 4-Channel Linear LED Current Sinks with Internal
MOSFETs Independently Drive Multiple LED Strings
• Full-Scale LED Current Adjustable from 20mA
to 150mA
• Drives 1 to 4 LED Strings
• 10000:1 PWM Dimming at 200Hz
● Flexible Current-Mode Architecture Supports a Wide
Range of Applications While Minimizing Interference
• Boost or SEPIC Current-Mode DC-DC Controller
• 200kHz to 2MHz Programmable Switching
Frequency
• External Switching-Frequency Synchronization
• Spread-Spectrum Mode
● Protection Features Enhance Fault Detection and
System Reliability
• Output-to-Ground Undervoltage Protection
• Open-Drain Fault-Indicator Output
• Open-LED and LED-Short Detection and
Protection
• Overtemperature Protection
● Adaptive Output-Voltage Optimization to Minimize
Power Dissipation
• Less than 2µA Shutdown Current
Applications
● Automotive Displays LED Backlights
● Automotive RCL, DRL, Front Position, and Fog Lights
● LCD TV and Desktop Display LED Backlights
● Architectural, Industrial, and Ambient Lighting
Ordering Information
PART
TEMP RANGE PIN-PACKAGE
MAX16813ATP+
-40°C to +125°C 20 TQFN-EP*
MAX16813ATP/V+ -40°C to +125°C 20 TQFN-EP*
MAX16813AUP+
-40°C to +125°C 20 TSSOP-EP*
MAX16813AUP/V+ -40°C to +125°C 20 TSSOP-EP*
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
/V denotes an automotive qualified part.
19-6713; Rev 4; 3/16


Maxim Integrated Semiconductor Electronic Components Datasheet

MAX16813 Datasheet

High-Brightness LED Driver

No Preview Available !

MAX16813
Integrated, 4-Channel, High-Brightness
LED Driver with High-Voltage DC-DC Controller
and Battery Disconnect
Absolute Maximum Ratings
IN to SGND............................................................-0.3V to +45V
EN, PGATE to SGND....................................-0.3V to (IN + 0.3V)
PGND to SGND.....................................................-0.3V to +0.3V
LEDGND to SGND................................................-0.3V to +0.3V
OUT_ to LEDGND..................................................-0.3V to +45V
VCC to SGND............. -0.3V to the lower of (IN + 0.3V) and +6V
FLT, DIM, RSDT, OVP to SGND..............................-0.3V to +6V
CS, NDRV, RT, COMP, SETI to SGND..... -0.3V to (VCC + 0.3V)
NDRV Peak Current (< 100ns)..............................................±3A
NDRV Continuous Current..............................................±100mA
OUT_ Continuous Current..............................................±175mA
VCC Short-Circuit Duration.........................................Continuous
Continuous Power Dissipation (TA = +70°C) (Note 1)
20-Pin TQFN (derate 25.6mW/°C above +70°C).......2051mW
20-Pin TSSOP (derate 26.5mW/°C above +70°C).....2122mW
Operating Temperature Range.......................... -40°C to +125°C
Junction Temperature.......................................................+150°C
Storage Temperature Range............................. -65°C to +150°C
Lead Temperature (soldering, 10s).................................. +300°C
Soldering Temperature (reflow)........................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (θJA).........+39°C/W
Junction-to-Case Thermal Resistance (θJC)................+6°C/W
TSSOP
Junction-to-Ambient Thermal Resistance (θJA)......+37.7°C/W
Junction-to-Case Thermal Resistance (θJC).............+2.0°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(VIN = VEN = 12V, RRT = 12.25kΩ, RSETI = 15kΩ, CVCC = 1µF, NDRV = COMP = OUT_ = PGATE = unconnected, VRSDT = VDIM =
VCC, VOVP = 0.7V, VCS = VLEDGND = VPGND = VSGND = 0V, TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values are
at TA = +25°C.) (Note 2)
PARAMETER
SUPPLIES
Operating Voltage Range
Supply Current
Standby Supply Current
IN Undervoltage Lockout
IN UVLO Hysteresis
VCC REGULATOR
Regulator Output Voltage
Dropout Voltage
Short-Circuit Current Limit
VCC Undervoltage-Lockout
Threshold
VCC UVLO Hysteresis
SYMBOL
CONDITIONS
VIN
IIN
IIN_Shdn
VOVP = 1.266V, all channels on,
VOUT_ = 0.5V
VEN = 0V
VIN rising
VCC
VCC_ILIM
6.5V < VIN < 10V, 1mA < ILOAD < 50mA
10V < VIN < 40V, 1mA < ILOAD < 10mA
VIN - VCC, VIN = 4.75V, ILOAD = 50mA
VCC shorted to SGND
VCC rising
MIN TYP MAX UNITS
4.75
40
3.4 5.7
12
3.975 4.3 4.625
170
V
mA
µA
V
mV
4.75 5 5.25
4.75 5 5.25
200 500
100
4
125
V
mV
mA
V
mV
www.maximintegrated.com
Maxim Integrated 2


Part Number MAX16813
Description High-Brightness LED Driver
Maker Maxim Integrated
Total Page 27 Pages
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