Dielectric Strength, kv/mm (v/mil)
Dielectric Constant @ 60 Hz
Dissipation Factor @ 60 Hz
Volume Resistivity, ohm-cm
Brittle Point, °C (°F)
operating temperature, °C (°F)
Maximum intermittent operating
temperature, °C (°F)
Coefficient of Expansion
cm/cm, °C (in/in, °F)
(1) Cure time 7 days at 25C (77F), 50% relative humidity.
(2) 1 in. x 8 in. stainless steel screen at 180°pull angle.
(3) Information is provided for customer convenience only. Properties are
not tested on a routine basis.
Specifications Typical product data values should not be used as specifications.
Assistance and specifications are available by contacting Momentive
Performance Materials at 800/255-8886
RTV162 and RTV167 sealants meet the physical requirements of MIL-A-
46146. Testing is performed in accordance with current Momentive
Performance Materials quality test methods, laboratory conditions, and
procedures, frequency and sampling, which are not necessarily identical
with the methods, conditions, procedures, frequency and sampling stated or
referenced in MIL-A-46146. Any certification will be limited to listed
properties and will not imply or state conformity to any other aspect of MIL-
A-46146, including but not limited to marking, packaging, bar coding,
testing, or sampling. Contact Momentive Performance Materials for a
Instructions for Use Applications
RTV160, RTV162 and RTV167 are recommended for use in aerospace,
automotive, appliance and other industries which incorporate electronic
components into a finished product. Electronic and integrated circuits,
semiconductors and copper connections are typical applications.
RTV160 adhesive sealant is recommended for insulating, encapsulating
and coating in thin sections [less than 6mm (1/4')], where flow into small
crevices or hard-to-reach places is desired.
RTV162 adhesive sealant is recommended for sealing and bonding of
electronic components onto printed circuit boards and protecting copper
connections on electronic parts assemblies.
RTV167 adhesive sealant is recommended for sealing and bonding where
high strength would be required.
Free Datasheet http://www.datasheet4u.com/