z Planar die construction. z 500mW power dissipation on ceramic PCB. z General purpose, medium current. z Ideally suited for automated assembly processes. Pb Lead-free .

z Zener diode. z Ultra-small surface mount package. ORDERING INFORMATION SOD-123 Type No. Marking Package Code BZT5.

BZT52C30

BZT52C30-F

BZT52C30-G

BZT52C30-V

BZT52C30CR-C

BZT52C30K

BZT52C30S

BZT52C30S-FL

BZT52C30V

BZT52C33

BZT52C33-F

BZT52C33-G

BZT52C33-V

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