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BZT52C30 Datasheet MDD

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Features and Benefits

z Planar die construction. z 500mW power dissipation on ceramic PCB. z General purpose, medium current. z Ideally suited for automated assembly processes. Pb Lead-free APPLICATIONS z Zener diode. z Ultra-small surface mount package. ORDERING INFORMATION SOD-123 Type No. Marking Package Code B.

BZT52C30 BZT52C30 BZT52C30
TAGS
Surface
mount
zener
diode
BZT52C30
BZT52C30-F
BZT52C30-G
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