SMBJ64C Datasheet | Micro Commercial Components

Features - For Surface Mount Applicationsin Order to Optimize Board Space - Low Inductance - Fast Response Time: Typical Less than 1ps From 0V to VBR min - Halogen Free. “Green” Device (Note 1) - Moisture Sensitivity Level 1 - Epoxy Meets UL 94 V-0 Flammability Rating - Lead Free Finish/Ro HS pliant (Note 2) ("P" Suffix Designates Ro HS pliant. See Ordering Information) - For Bidirectional Devices Add “C” To The Suffix of The Part Number: i.e.SMBJ5.0CA for 5% Tolerance Mechanical Data - Polarity: Color Band Denotes Positive end( cathode) Except Bi-directional Types - Maximum Soldering Temperature:260°C for 10 Seconds - Terminals: Solderable Per MIL-STD-750, Method 2026 Maximum Ratings - Operating Junction Temperature Range: -55°C to +175°C - Storage Temperature Range: -55°C to +175°C - Thermal Resistance :20°C/W Junction to Lead - Thermal Resistance :25°C/W Junction to Case - Thermal Resistance :100°C/W Junction to Ambient Electrical Characteristics @ 25°C Unless Otherwise Specified Peak Pulse Power Surge Current on 10/1000μs Waveform See the Table Note 3 Peak Pulse Power Dissipation 600W Note 3,4,5 Steady State Power Dissipation PM(AV) 5.0W Note 6 Peak Forward Surge Current 8.3 ms Single Half IFSM 100A Sine-Wave Unidirectional Only NOTES: 1. Halogen free "Green"products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony pounds. 2. High Temperature Solder Exemption Applied, see EU Directive Annex 7a. 3. Non-repetitive current pulse, per Fig.3 and derated above TA=25 °C per Fig.4 4. Mounted on 5.0mm2 copper pads to each terminal. 5. Peak pulse current waveform is 10/1000us, with maximum duty Cycle of 0.01%. 6. Power dissipation, on infinite heat sink at TL=75o C Pin Configuration: Cathode...