SMB10J5.0(C)A THRU SMB10J120(C)A
E480232
Features
• Glass Passivated Chip
• 1000W Peak Pulse Power Capability with a 10/1000 us Waveform,
Repetitive Rate(dutycycle):0.01%
• Low Inductance
• For Bidirectional Devices Add “C” To The Suffix of
• The Part Number: i.e.SMB10J5.0CA for 5% Tolerance
• Halogen Free Available Upon Request By Adding Suffix "-HF"
• Moisture Sensitivity Level 1
• Epoxy Meets UL 94 V-0 Flammability Rating
• Lead Free Finish/RoHS Compliant (Note1) ("P" Suffix Designates
RoHS Compliant. See Ordering Information)
Mechanical Data
• Terminals: Solderable Per MIL-STD-750, Method 2026
• Polarity: Color Band Denotes Positive End (cathode) Except
Bidirectiona
Maximum Ratings
• Operating Junction Temperature Range: -55°C to +150°C
• Storage Temperature Range: -55°C to +150°C
Electrical Characteristics @ 25°C Unless Otherwise Specified
Peak Pulse Power
Surge Current on
IPP
10/1000μs Waveform
See the Table Note 2
Peak Pulse Power
Dissipation
PPP
1000W
Note 2
Power Dissipationon
infinite heat sink
PD
5.0W
TL = 75°C
Peak forward surge
current
IFSM
100A
Note 3
Maximum
instantaneous forward
voltage at 25A for
VF
unidirectional only
3.5V/5.0V Note 4
Notes:
1. High Temperature Solder Exemption Applied, see EU Directive Annex 7a.
2. Non-repetitive current pulse, per Fig.3 and derated above TA=25 °C per Fig.4
3. Measured on 8.3 ms single half sine-wave or equivalent square wave, duty cycle =
4 pulses per minute maximum
4. VF <3.5V for devices of VBR<50V
Pin Configuration:
Cathode
Uni-directional
Rev.3-3-04242019
Anode
Bi-directional
1/4
1000 Watt TVS
5.0 to 120 Volts
SMB (DO-214AA)
(LEAD FRAME)
H
Cathode Mark
E
F
G
J
A
D
C
B
DIMENSIONS
DIM
INCHES
MM
MIN MAX MIN MAX
A 0.079 0.103 2.00 2.62
B 0.075 0.087 1.91 2.21
C 0.002 0.008 0.05 0.20
D 0.006 0.012 0.15 0.31
E 0.030 0.060 0.76 1.52
F 0.065 0.091 1.65 2.32
G 0.200 0.220 5.08 5.59
H 0.160 0.191 4.06 4.85
J 0.130 0.155 3.30 3.94
NOTE
Suggested Solder Pad Layout
1.80mm
2.30mm
2.50mm
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