MCC
omponents
20736 Marilla Street Chatsworth
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Features
l For surface mount applicationsin in or der to optimize
boar d space
l L ow pr ofil e package
l Fast response time: typical less than 1.0ps from 0 volts to
VBR minimum
l Low inductance
l Excellent clamping capability
Mechanical Data
l CASE: JEDEC DO-214AC
l Terminals: solderable per MIL-STD-750, Method 2026
l Polarity: Color band denotesposit ive end (cathode)
except Bidirectional
l Maximum soldering temperature: 250oC for 10 seconds
Maximum Ratings @ 25oC Unless Otherwise Specified
Peak Pulse Current on
10/1000us waveform
Peak Pulse Power
Dissipation
Peak Forward Surge
Current
IPP See Table 1 Note: 1
PPP 400W Note: 1,
IFSM)
40A Note: 3
Operation And Storage TJ, TSTG -55oC to
Temperature Range
+150oC
P4SMAJ6.8(C)A
THRU
P4SMAJ550(C)A
Transient
Voltage Suppressor
6.8 to 550 Volts
400 W att
DO-214AC
(SMAJ)( LEAD FRAME)
H
J
AC
E
F
G
DB
DIMENSIONS
INCHES
DIM MIN
MAX
A .079 .096
B .050 .064
C .002 .008
D ---
.02
E .030 .060
F .065 .091
G .189 .220
H .157 .181
J .090 .115
MM
MIN
2.00
1.27
.05
---
.76
1.65
4.80
4.00
2.25
MAX
2.44
1.63
.20
.51
1.52
2.32
5.59
4.60
2.92
SUGGESTED SOLDER
PAD LAYOUT
0.085 ”
MA X 5”
NOTE
NOTES:
1. Non-repetitive current pulse, per Fig.3 and derated above
TA=25oC per Fig.2.
2. Mounted on 5.0mm2 copper pads to each terminal.
3. 8.3ms, single half sine wave duty cycle=4 pulses per. Minute
maximum.
0.058 ”MI N 5”
0.05
MI N
5”
5”
Revision: 1
www.mccsemi.com
2004/06/24
