x Planar Die Construction x 200mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes
* Epoxy meet.

BZT52C6V2

BZT52C6V2-F

BZT52C6V2-G

BZT52C6V2-V

BZT52C6V2CR-C

BZT52C6V2K

BZT52C6V2LP

BZT52C6V2S-FL

BZT52C6V8

BZT52C6V8-F

BZT52C6V8-G

BZT52C6V8-V

BZT52C6V8CR-C

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