x Planar Die Construction x 500mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes
* Epoxy meet.

BZT52C51-F

BZT52C51-G

BZT52C51-V

BZT52C51CR-C

BZT52C51K

BZT52C51S

BZT52C51S-FL

BZT52C51V

BZT52C56

BZT52C56-G

BZT52C56-V

BZT52C56CR-C

BZT52C56K

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