x Planar Die Construction x 500mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes
* Epoxy meet.

BZT52C30

BZT52C30-F

BZT52C30-G

BZT52C30-V

BZT52C30CR-C

BZT52C30K

BZT52C30S

BZT52C30S-FL

BZT52C30V

BZT52C33

BZT52C33-F

BZT52C33-G

BZT52C33-V

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