x Planar Die Construction x 200mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes
* Epoxy meet.

BZT52C18

BZT52C18-F

BZT52C18-G

BZT52C18-V

BZT52C18CR-C

BZT52C18K

BZT52C18LP

BZT52C18S-FL

BZT52C18V

BZT52C10

BZT52C10-F

BZT52C10-G

BZT52C10-V

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