x Planar Die Construction x 500mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes
* Epoxy meet.

BZT52C10

BZT52C10-F

BZT52C10-G

BZT52C10-V

BZT52C10CR-C

BZT52C10K

BZT52C10LP

BZT52C10S

BZT52C10S-FL

BZT52C10V

BZT52C11

BZT52C11-F

BZT52C11-G

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