x Planar Die Construction x 410mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes x Case Material:.

BZT52B9V1-G

BZT52B9V1-V

BZT52B9V1S

BZT52B9V1S-C

BZT52B9V1S-FL

BZT52B10

BZT52B10-G

BZT52B10-V

BZT52B10S

BZT52B10S-C

BZT52B10S-FL

BZT52B11

BZT52B11-G

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