x Planar Die Construction x 410mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes x Case Material:.

BZT52B4V3-G

BZT52B4V3-V

BZT52B4V3S

BZT52B4V3S-C

BZT52B4V3S-FL

BZT52B4V7

BZT52B4V7-G

BZT52B4V7-V

BZT52B4V7S

BZT52B4V7S-C

BZT52B4V7S-FL

BZT52B43

BZT52B43-G

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