BZT52B3V0 Datasheet, MCC

x Planar Die Construction x 410mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes x Case Material:.

BZT52B3V0-G

BZT52B3V0-V

BZT52B3V0S

BZT52B3V0S-C

BZT52B3V0S-FL

BZT52B3V3

BZT52B3V3-G

BZT52B3V3-V

BZT52B3V3S

BZT52B3V3S-C

BZT52B3V3S-FL

BZT52B3V6

BZT52B3V6-G