BZT52B33 Datasheet, MCC

x Planar Die Construction x 410mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes x Case Material:.

BZT52B30

BZT52B30-G

BZT52B30-V

BZT52B30S

BZT52B30S-C

BZT52B30S-FL

BZT52B33-G

BZT52B33-V

BZT52B33S

BZT52B33S-C

BZT52B33S-FL

BZT52B36

BZT52B36-G