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913R7K-BSP-3 - Binary Chip Capacitors

This page provides the datasheet information for the 913R7K-BSP-3, a member of the 911R5K-BSP-3 Binary Chip Capacitors family.

Datasheet Summary

Description

The 91xRxK-BOO and -BSP Series binary chip capacitors are designed to facilitate bread-boarding or to use where a trimming capability is required.

These devices feature the same dielectric layer and bonding surfaces as our 9000 and 9100 Series chip capacitors.

Features

  • High Reliability Silicon Nitride/Oxide Dielectric.
  • Low Loss.
  • Long Term Reliability & Stability.
  • RoHS.
  • Compliant.

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Datasheet preview – 913R7K-BSP-3

Datasheet Details

Part number 913R7K-BSP-3
Manufacturer MACOM
File Size 383.67 KB
Description Binary Chip Capacitors
Datasheet download datasheet 913R7K-BSP-3 Datasheet
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Full PDF Text Transcription

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Binary Chip Capacitors Features • High Reliability Silicon Nitride/Oxide Dielectric • Low Loss • Long Term Reliability & Stability • RoHS* Compliant Description The 91xRxK-BOO and -BSP Series binary chip capacitors are designed to facilitate bread-boarding or to use where a trimming capability is required. These devices feature the same dielectric layer and bonding surfaces as our 9000 and 9100 Series chip capacitors. By connecting the pads in parallel, the capacitance values are additive, so many combinations are possible. The BSP-1 chip offers the same capacitance values as BOO and BSP-3, but in a slightly larger chip with a more accommodating layout for ease of bonding. The top contact and backside terminals are gold.
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