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XP1039-QJ - Power Amplifier

Download the XP1039-QJ datasheet PDF. This datasheet also covers the XP1039-QJ-MA variant, as both devices belong to the same power amplifier family and are provided as variant models within a single manufacturer datasheet.

General Description

The XP1039-QJ is a packaged linear power amplifier that operates from 5.6-7.1 GHz.

The device provides 17 dB gain and 48 dBm Output Third Order Intercept Point (OIP3).

Key Features

  •  17 dB Small Signal Gain.
  •  48 dBm Third Order Intercept Point (OIP3).
  •  2 W P1dB.
  •  Integrated Power Detector.
  •  Lead-Free 6 mm 24-lead QFN Package.
  •  RoHS Compliant and 260°C Reflow Compatible.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (XP1039-QJ-MA-COM.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

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XP1000-BD GaAs MMIC Power Amplifier Mimix Broadband
XP1001 GaAs MMIC Power Amplifier Mimix Broadband

Other Datasheets by MACOM Technology Solutions

Part Number Description
XP1031-QK Power Amplifier
XP1035-QH Power Amplifier
XP1005-BD Power Amplifier
XP1042-QT Power Amplifier
XP1043-QH Power Amplifier

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
XP1039-QJ 2.5 W Power Amplifier 5.6 - 7.1 GHz Features  17 dB Small Signal Gain  48 dBm Third Order Intercept Point (OIP3)  2 W P1dB  Integrated Power Detector  Lead-Free 6 mm 24-lead QFN Package  RoHS Compliant and 260°C Reflow Compatible Description The XP1039-QJ is a packaged linear power amplifier that operates from 5.6-7.1 GHz. The device provides 17 dB gain and 48 dBm Output Third Order Intercept Point (OIP3). The packaged amplifier comes in an industry standard, fully molded 6 mm QFN package and is comprised of a two stage power amplifier with an integrated, temperature compensated on-chip power detector. The device includes on-chip ESD protection structures and DC by-pass capacitors to ease the implementation and volume assembly of the packaged part.