MMP7089-127-1 Overview
Description
The MMP7000‐127 MELF PIN diode series is manufactured using a proprietary diode process which optimizes the anode and cathode bonding area of the diode to the adjacent heat spreading metal posts within the ceramic package. This unique geometry provides lower electrical a nd With lower.
Key Features
- Ceramic Surface Mount Package
- Low RS <1 Ω (lower insertion loss & higher IIP3)
- Hermetically Sealed
- RoHS* Compliant
