MMP7080-127-1
Overview
The MMP7000‐127 MELF PIN diode series is manufactured using a proprietary diode process which optimizes the anode and cathode bonding area of the diode to the adjacent heat spreading metal posts within the ceramic package. This unique geometry provides lower electrical a nd thermal resistance within the surface mount package to provide higher average power performance to comparable surface mount diode packages.
- Ceramic Surface Mount Package
- Low RS <1 Ω (lower insertion loss & higher IIP3)
- Low Thermal Resistance <20°C/W for Higher Power
- Hermetically Sealed
- RoHS* Compliant
