MMP7080-127-1 Datasheet | MACOM Technology Solutions

MMP70xx-127 Series MELF PIN Diodes Features - Ceramic Surface Mount Package - Low RS <1 Ω (lower insertion loss & higher IIP3) - Low Thermal Resistance <20°C/W for Higher Power - Hermetically Sealed - Ro HS- pliant Description The MMP7000‐127 MELF PIN diode series is manufactured using a proprietary diode process which optimizes the anode and cathode bonding area of the diode to the adjacent heat spreading metal posts within the ceramic package. This unique geometry provides lower electrical a nd thermal resistance within the surface mount package to provide higher average power performance to parable surface mount diode packages. With lower thermal resistance (<20 ºC/W), RF C.W. incident power levels of 50 d Bm and RF peak incident power levels of 60 d Bm are very achievable in higher power UHF cold switching applications. The low series resistance (<1 Ω), coupled with the longer minority carrier lifetime, (>8 μs), provides better IIP3 distortion values >70 d Bm,...