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MASW-009276-001DIE - Bumped GaAs SP3T Switch

Download the MASW-009276-001DIE datasheet PDF. This datasheet also covers the MASW-009276-001DIE-MA variant, as both devices belong to the same bumped gaas sp3t switch family and are provided as variant models within a single manufacturer datasheet.

General Description

The MASW-009276-001DIE is a bumped GaAs pHEMT MMIC SP3T switch.

Typical applications are WLAN (802.11 b/g) and Bluetooth applications.

The MASW-009276-001DIE delivers high isolation, low insertion loss, and high linearity at 2.4 - 2.5 GHz.

Key Features

  • 802.11b/g and Bluetooth.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MASW-009276-001DIE-MA-COM.pdf) that lists specifications for multiple related part numbers.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
MASW-009276-001DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz Rev. V2 Features • 802.11b/g and Bluetooth Applications • Low Insertion Loss: 0.5 dB 2.4 GHz to 2.5 GHz band • High Isolation: 32 dB Typical on RX • Low Harmonics: <-70 dBc @ 20 dBm • Flip-chip configuration • RoHS* Compliant Description The MASW-009276-001DIE is a bumped GaAs pHEMT MMIC SP3T switch. Typical applications are WLAN (802.11 b/g) and Bluetooth applications. Die Bump Pad Layout (bump side up) The MASW-009276-001DIE delivers high isolation, low insertion loss, and high linearity at 2.4 - 2.5 GHz. This device is fabricated using a 0.5 micron gate length GaAs pHEMT process. The process features full passivation for performance and reliability. This die features SnAg(3.