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MADP-042405-13060 - PIN Diodes

Download the MADP-042405-13060 datasheet PDF. This datasheet also covers the MADP-042305-13060-MA variant, as both devices belong to the same pin diodes family and are provided as variant models within a single manufacturer datasheet.

Description

This device is a silicon, glass PIN diode surmount chip fabricated with M/A-COM Tech’s patented HMICTM process.

Features

  •  Surface Mount.
  •  No Wirebonds Required.
  •  Rugged Silicon-Glass Construction.
  •  Silicon Nitride Passivation.
  •  Polymer Scratch Protection.
  •  Low Parasitic Capacitance and Inductance.
  •  High Average and Peak Power Handling.
  •  RoHS Compliant.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MADP-042305-13060-MA-COM.pdf) that lists specifications for multiple related part numbers.

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Other Datasheets by MACOM Technology Solutions

Part Number Description
MADP-042305-13060 PIN Diodes
MADP-042505-13060 PIN Diodes
MADP-042905-13060 PIN Diodes
MADP-000907-14020P Solderable AlGaAs Flip-Chip
MADP-000907-14020W Solderable AlGaAs Flip-Chip

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
MADP-042XX5-13060 Series SURMOUNTTM PIN Diodes: RoHS Rev. V6 Features  Surface Mount  No Wirebonds Required  Rugged Silicon-Glass Construction  Silicon Nitride Passivation  Polymer Scratch Protection  Low Parasitic Capacitance and Inductance  High Average and Peak Power Handling  RoHS Compliant Description This device is a silicon, glass PIN diode surmount chip fabricated with M/A-COM Tech’s patented HMICTM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device.
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