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MADP-030015-1314 - PIN Diodes

Download the MADP-030015-1314 datasheet PDF. This datasheet also covers the MADP-017015-1314-MA variant, as both devices belong to the same pin diodes family and are provided as variant models within a single manufacturer datasheet.

General Description

This device is a silicon, glass PIN diode surmount chip fabricated with M/A-COM Technology Solutions patented HMICTM process.

Key Features

  • 0603 Outline.
  • Surface Mount.
  • 15µm I-Region Length Devices.
  • No Wirebonds Required.
  • Silicon Nitride Passivation.
  • Polymer Scratch Protection.
  • Low Parasitic Capacitance and Inductance.
  • High Average and Peak Power Handling.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MADP-017015-1314-MA-COM.pdf) that lists specifications for multiple related part numbers.

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Other Datasheets by MACOM Technology Solutions

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
MADP-017015-1314 MADP-030015-1314 SURMOUNT™ 15μM PIN Diodes RoHS Compliant Features ♦ 0603 Outline ♦ Surface Mount ♦ 15µm I-Region Length Devices ♦ No Wirebonds Required ♦ Silicon Nitride Passivation ♦ Polymer Scratch Protection ♦ Low Parasitic Capacitance and Inductance ♦ High Average and Peak Power Handling Description This device is a silicon, glass PIN diode surmount chip fabricated with M/A-COM Technology Solutions patented HMICTM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device.