MADP-030015-1314 Datasheet PDF - MA-COM PIN Diodes Specs

MADP-030015-1314 - PIN Diodes

This page provides the datasheet information for the MADP-030015-1314, a member of the MADP-017015-1314-MA PIN Diodes family.

Datasheet Summary

Description

This device is a silicon, glass PIN diode surmount chip fabricated with M/A-COM Technology Solutions patented HMICTM process.

Features

0603 Outline.
Surface Mount.
15µm I-Region Length Devices.
No Wirebonds Required.
Silicon Nitride Passivation.
Polymer Scratch Protection.
Low Parasitic Capacitance and Inductance.
High Average and Peak Power Handling.

Datasheet Details

Part number	MADP-030015-1314
Manufacturer	MA-COM
File Size	238.10 KB
Description	PIN Diodes
Datasheet	MADP-030015-1314 Datasheet
Additional preview pages of the MADP-030015-1314 datasheet.

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Full PDF Text Transcription

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MADP-017015-1314 MADP-030015-1314 SURMOUNT™ 15μM PIN Diodes RoHS Compliant Features ♦ 0603 Outline ♦ Surface Mount ♦ 15µm I-Region Length Devices ♦ No Wirebonds Required ♦ Silicon Nitride Passivation ♦ Polymer Scratch Protection ♦ Low Parasitic Capacitance and Inductance ♦ High Average and Peak Power Handling Description This device is a silicon, glass PIN diode surmount chip fabricated with M/A-COM Technology Solutions patented HMICTM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device.

Published: Apr 9, 2016 |