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MA4FCP305 - Silicon Flip Chip PIN Diode

Download the MA4FCP305 datasheet PDF. This datasheet also covers the MA4FCP305-MA variant, as both devices belong to the same silicon flip chip pin diode family and are provided as variant models within a single manufacturer datasheet.

Description

The MA4FCP305 is a silicon flip chip PIN diode fabricated using MACOM’s HMIC process.

The epitaxial wafers used to fabricated this flip chip are designed for repeatable electrical characteristics and extremely low parasitics.

Features

  • Low Series Resistance: 1.7 Ω.
  • Low Capacitance: 50 fF.
  • Fast Switching Speed: 20 ns.
  • Silicon Nitride Passivation.
  • Polyimide Scratch Protection.
  • Designed for Automated Pick and Place Insertion.
  • Rugged Design.
  • RoHS.
  • Compliant.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MA4FCP305-MA-COM.pdf) that lists specifications for multiple related part numbers.

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
Silicon Flip Chip PIN Diode Features • Low Series Resistance: 1.7 Ω • Low Capacitance: 50 fF • Fast Switching Speed: 20 ns • Silicon Nitride Passivation • Polyimide Scratch Protection • Designed for Automated Pick and Place Insertion • Rugged Design • RoHS* Compliant Applications • Aerospace & Defense • ISM Description The MA4FCP305 is a silicon flip chip PIN diode fabricated using MACOM’s HMIC process. The epitaxial wafers used to fabricated this flip chip are designed for repeatable electrical characteristics and extremely low parasitics. The diode is fully passivated with silicon nitride and also has an additional layer of polyimide for scratch protection.
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