Surface Mount – 600V - 800V > MCR08B, MCR08M
Maximum Ratings (TJ = 25°C unless otherwise noted)
Peak Repetitive Off−State Voltage (Note 1)
(− 40 to 125°C, Sine Wave, 50 to 60 Hz, Gate Open)
On-State RMS Current (All Conduction Angles; TC = 80°C)
Peak Non-Repetitive Surge Current
(1/2 Cycle Sine Wave, 60 Hz, TC = 25°C)
Circuit Fusing Consideration (t = 8.3 ms)
Forward Peak Gate Power (TC = 80°C, t = 1.0 µs)
Average Gate Power (t = 8.3 ms, TC = 80°C)
Operating Junction Temperature Range
Storage Temperature Range
-40 to +125
-40 to +150
Thermal Resistance, Junction−to−Case (AC) PCB Mounted per Figure 1
Thermal Resistance, Junction−to−Tab Measured on Anode Tab Adjacent
Maximum Device Temperature for Soldering Purposes
(for 10 Seconds Maximum)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent with negative
potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded.
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.