alue
–45
–50
–5.0
–500
Unit V V V
mAdc
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR
– 5 Board, (1) TA = 25°C Derate above 25°C Thermal Resistance, Junction to Ambient Total Device Dissipation Alumina Substrate, (2) TA = 25°C Derate above 25°C Thermal Resistance, Junction to Am.