— Planar Die Construction — 500mW Power Dissipation on Ceramic PCB — General Purpose, Medium Current — Ideally Suited for Automated Assembly Processes Mechanical Data — C.

BZT52C9V1-F

BZT52C9V1-G

BZT52C9V1-V

BZT52C9V1CR-C

BZT52C9V1K

BZT52C9V1LP

BZT52C9V1S

BZT52C9V1S-FL

BZT52C10

BZT52C10-F

BZT52C10-G

BZT52C10-V

BZT52C10CR-C

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