MM1W56L Overview
Solderable per MIL-STD-750, Method 2026 Approx. mounted with 2.0" X 2.0" (5 X 5 cm) copper areas pads. Unit W V °C/W °C Power Dissipation (W) Transient Thermal Impedance（°C/W） Fig.1.
MM1W56L Key Features
- Total power dissipation: Max. 1 W
- Wide zener reverse voltage range 3.3V to 330V
- Small plastic package suitable for surface mounted design
- Case: SOD-123FL
- Terminals: Solderable per MIL-STD-750, Method 2026
- Approx. Weight:15mg 0.00048oz
