* For surface mounted applications
* Low profile package
* Glass Passivated Chip Junction
* Superfast reverse recovery time
* Lead free in comply with.

* Low profile package
* Glass Passivated Chip Junction
* Superfast reverse recovery time
* Lead free in .

1 Input Pin（~） 2 Input Pin（~） 3 Output Anode（+） 4 Output Cathode（-） MECHANICAL DATA
* Case: MBS
* Terminals: Solderable per MIL-STD-750, Method 2026
* Approx. Weight: 100mg / 0.0035oz 3 4 2 1 MBS Package Absolute Maximum Ratings and .

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