US2AAF THRU US2MAF
2.0 Amp. Surface Mount Glass Passivated High Efficient Rectifiers
Features
* For surface mounted application
* Low Profile Package
* Glass Passivated Chip Junction
* High Temp Soldering: 260℃ for 10seconds at Terminals
* Superfast Recovery Times
A
C
B DE
G
F
DIM.
A
B
C
D
E
F
G
SMAF
INCHES
MIN MAX
0.173
0.193
0.094
0.106
0.130
0.146
0.051
0.063
0.035
0.043
0.005
0.008
0.031
0.047
MM
MIN MAX
4.40 4.90
2.40 2.70
3.30 3.70
1.30 1.60
0.90 1.10
0.12 0.20
0.80 1.20
Mechanical Data
* Case: SMAF Molded plastic
* Terminals: Solderable per MIL-STD-750, Method 2026
* Polarity: Indicated by cathode band
Maximum Ratings and Electrical Characteristics (TA=25℃ unless otherwise noted)
Type Number
Maximum Repetitive Peak Reverse Voltage
Maximum RMS Voltage
Maximum D.C Blocking Voltage
Maximum Average Forward Rectified Current
Peak Forward Surge Current, 8.3ms single half
sine-wave
Symbols
US2AA US2BA US2DA US2GA US2JA US2KA US2MA
FFFFFFF
VRRM
50 100 200 400 600 800 1000
VRMS 35 70 140 280 420 560 700
VDC 50 100 200 400 600 800 1000
IF(AV)
2
Unit
V
V
V
A
IFSM
50
A
Maximum Instantaneous Forward Voltage at 2.0A
VF
1.0
Maximum D.C Reverse Current @ TJ=25℃
at Rated D.C Blocking Voltage @ TJ=125℃
IR
Maximum Reverse Recovery Time (Note1)
Trr
50
Typical thermal resistance (Note2)
RθJA
RθJC
Operating and Storage Temperature Range
TJ / TSTG
Note 1: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
Note 2: P.C.B. mounted with 2.0" X 2.0" (5 X 5 cm) copper pad areas.
1.3
5
100
65
20
-55 to +150
1.7
75
V
μA
nS
℃/W
℃
Version: 6.1
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