BZT52C9V1S Overview
Features Planar die construction Ultra-Small Surface Mount Package Ideally suited for automated assembly processes BZT52C2V4S THRU BZT52C75S Surface Mount Zener Diodes A C BD Case: SOD-323, Molded plastic Terminals: Solderable per MIIL-STD-202, Method 208 Polarity:.
BZT52C9V1S Key Features
- Planar die construction
- Ultra-Small Surface Mount Package
- Ideally suited for automated assembly processes
- Case: SOD-323, Molded plastic
- Terminals: Solderable per MIIL-STD-202, Method 208
- Polarity: Cathode Band
- 55 to + 150
