z Planar die construction z 200mW power dissipation on ceramic PBC z General purpose, medium current z Ideally suited for automated assembly processes z Available in lead.

BZT52C4V3

BZT52C4V3-F

BZT52C4V3-G

BZT52C4V3-V

BZT52C4V3CR-C

BZT52C4V3K

BZT52C4V3LP

BZT52C4V3S-FL

BZT52C4V7

BZT52C4V7-F

BZT52C4V7-G

BZT52C4V7-V

BZT52C4V7CR-C

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