z Planar Die Construction z 350mW Power Dissipation on Ceramic PCB z General Purpose, Medium Current z Ideally Suited for Automated Assembly Processes z Available in Lea.

BZT52C43-F

BZT52C43-G

BZT52C43-V

BZT52C43CR-C

BZT52C43K

BZT52C43S

BZT52C43S-FL

BZT52C43V

BZT52C47

BZT52C47-F

BZT52C47-G

BZT52C47-V

BZT52C47CR-C

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