z Planar die construction z 200mW power dissipation on ceramic PBC z General purpose, medium current z Ideally suited for automated assembly processes z Available in lead.

BZT52C36

BZT52C36-F

BZT52C36-G

BZT52C36-V

BZT52C36CR-C

BZT52C36K

BZT52C36LP

BZT52C36S-FL

BZT52C36V

BZT52C30

BZT52C30-F

BZT52C30-G

BZT52C30-V

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