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InvenSense

MPU-3050 Datasheet Preview

MPU-3050 Datasheet

Motion Processing Unit

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MPU-3050
MPU-3050
Motion Processing Unit
Product Specification
InvenSense reserves the right to change the
detail specifications as may be required to
permit improvements in the design of its
products.
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
www.invensense.com
Document Number: PS-MPU-3050A-00
Revision: 2.7
Rev. Date: 03/10/2016




InvenSense

MPU-3050 Datasheet Preview

MPU-3050 Datasheet

Motion Processing Unit

No Preview Available !

MPU-3050
TABLE OF CONTENTS
1 INTRODUCTION....................................................................................................................................................4
1.1 PURPOSE AND SCOPE ............................................................................................................................................... 4
1.2 PRODUCT OVERVIEW ............................................................................................................................................... 4
1.3 APPLICATIONS......................................................................................................................................................... 5
2 FEATURES ............................................................................................................................................................6
2.1 SENSORS................................................................................................................................................................ 6
2.2 DIGITAL OUTPUT ..................................................................................................................................................... 6
2.3 MOTION PROCESSING .............................................................................................................................................. 6
2.4 CLOCKING .............................................................................................................................................................. 6
2.5 POWER.................................................................................................................................................................. 6
2.6 PACKAGE ............................................................................................................................................................... 7
3 ELECTRICAL CHARACTERISTICS.............................................................................................................................8
3.1 SENSOR SPECIFICATIONS ........................................................................................................................................... 8
3.2 ELECTRICAL SPECIFICATIONS....................................................................................................................................... 9
3.3 ELECTRICAL SPECIFICATIONS, CONTINUED ................................................................................................................... 10
3.4 ELECTRICAL SPECIFICATIONS, CONTINUED ................................................................................................................... 11
3.5 I2C TIMING CHARACTERIZATION ............................................................................................................................... 12
3.6 ABSOLUTE MAXIMUM RATINGS ............................................................................................................................... 13
4 APPLICATIONS INFORMATION ...........................................................................................................................14
4.1 PIN OUT AND SIGNAL DESCRIPTION .......................................................................................................................... 14
4.2 TYPICAL OPERATING CIRCUITS.................................................................................................................................. 15
4.3 BILL OF MATERIALS FOR EXTERNAL COMPONENTS ....................................................................................................... 15
4.4 RECOMMENDED POWER-ON PROCEDURE................................................................................................................... 16
5 FUNCTIONAL OVERVIEW....................................................................................................................................17
5.1 BLOCK DIAGRAM................................................................................................................................................... 17
5.2 OVERVIEW ........................................................................................................................................................... 17
5.3 THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING ............................................................ 17
5.4 DIGITAL MOTION PROCESSOR.................................................................................................................................. 18
5.5 PRIMARY I2C SERIAL COMMUNICATIONS INTERFACE..................................................................................................... 18
5.6 SECONDARY I2C SERIAL INTERFACE (FOR A THIRD-PARTY ACCELEROMETER)....................................................................... 18
6 CLOCKING ..........................................................................................................................................................19
6.1 INTERNAL CLOCK GENERATION................................................................................................................................. 19
6.2 CLOCK OUTPUT..................................................................................................................................................... 19
6.3 SENSOR DATA REGISTERS........................................................................................................................................ 19
6.4 FIFO................................................................................................................................................................... 19
6.5 INTERRUPTS.......................................................................................................................................................... 19
6.6 BIAS AND LDO...................................................................................................................................................... 20
6.7 CHARGE PUMP...................................................................................................................................................... 20
6.8 CHIP VERSION....................................................................................................................................................... 20
7 DIGITAL INTERFACE............................................................................................................................................21
7.1 I2C SERIAL INTERFACE............................................................................................................................................. 21
8 SERIAL INTERFACE CONSIDERATIONS (MPU-3050).............................................................................................25
Rev Date: 03/10/2016
Document Number: PS-MPU-3050A-00
Revision: 2.7
InvenSense Confidential & Proprietary
Page 2 of 52


Part Number MPU-3050
Description Motion Processing Unit
Maker InvenSense
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