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InvenSense

ITG-1010 Datasheet Preview

ITG-1010 Datasheet

3-Axis MEMS gyroscope IC

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InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A.
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: www.invensense.com
Document Number: PS-ITG-1010A-00
Revision: 1.1
Release Date: 03/02/2015
ITG-1010
Product Specification
Revision 1.1
Confidential & Proprietary
1 of 46




InvenSense

ITG-1010 Datasheet Preview

ITG-1010 Datasheet

3-Axis MEMS gyroscope IC

No Preview Available !

ITG-1010 Product Specification
Document Number: PS-ITG-1010A-00
Revision: 1.1
Release Date: 03/02/2015
CONTENTS
1 DOCUMENT INFORMATION .....................................................................................................................4
1.1 REVISION HISTORY.................................................................................................................................4
1.2 PURPOSE AND SCOPE ............................................................................................................................5
1.3 PRODUCT OVERVIEW..............................................................................................................................5
1.4 APPLICATIONS........................................................................................................................................5
2 FEATURES .................................................................................................................................................6
2.1 SENSORS...............................................................................................................................................6
2.2 DIGITAL OUTPUT ....................................................................................................................................6
2.3 DATA PROCESSING ................................................................................................................................6
2.4 CLOCKING..............................................................................................................................................6
2.5 POWER..................................................................................................................................................6
2.6 PACKAGE...............................................................................................................................................6
3 ELECTRICAL CHARACTERISTICS ..........................................................................................................7
3.1 SENSOR SPECIFICATIONS .......................................................................................................................7
3.2 ELECTRICAL SPECIFICATIONS..................................................................................................................8
3.3 ELECTRICAL SPECIFICATIONS, CONTINUED ..............................................................................................9
3.4 I2C TIMING CHARACTERIZATION ............................................................................................................10
3.5 SPI TIMING CHARACTERIZATION ...........................................................................................................11
3.6 ABSOLUTE MAXIMUM RATINGS..............................................................................................................12
4 APPLICATIONS INFORMATION .............................................................................................................13
4.1 PIN OUT AND SIGNAL DESCRIPTION.......................................................................................................13
4.2 TYPICAL OPERATING CIRCUIT ...............................................................................................................14
4.3 BILL OF MATERIALS FOR EXTERNAL COMPONENTS.................................................................................14
5 FUNCTIONAL OVERVIEW.......................................................................................................................15
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10
BLOCK DIAGRAM ..................................................................................................................................15
OVERVIEW ...........................................................................................................................................15
THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING ..................................15
I2C AND SPI SERIAL COMMUNICATIONS INTERFACE ...............................................................................15
INTERNAL CLOCK GENERATION .............................................................................................................16
SENSOR DATA REGISTERS ...................................................................................................................16
FIFO ...................................................................................................................................................16
INTERRUPTS.........................................................................................................................................16
DIGITAL-OUTPUT TEMPERATURE SENSOR .............................................................................................16
BIAS AND LDO .....................................................................................................................................16
6 DIGITAL INTERFACE...............................................................................................................................17
6.1 I2C SERIAL INTERFACE .........................................................................................................................17
7 SERIAL INTERFACE CONSIDERATIONS ..............................................................................................22
7.1 SUPPORTED INTERFACES .....................................................................................................................22
7.2 LOGIC LEVELS......................................................................................................................................22
8 ASSEMBLY...............................................................................................................................................23
8.1 ORIENTATION OF AXES .........................................................................................................................23
8.2 PACKAGE DIMENSIONS .........................................................................................................................24
8.3 PACKAGE MARKING SPECIFICATION ......................................................................................................25
Confidential & Proprietary
2 of 46


Part Number ITG-1010
Description 3-Axis MEMS gyroscope IC
Maker InvenSense
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