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CD4009UBMS Datasheet

CMOS Hex Buffers/Converter

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Data Sheet
CD4009UBMS
November 1994
File Number 3293
CMOS Hex Buffers/Converter
CD4009UBMS Hex Buffer/Converter may be used as a
CMOS to TTL or DTL logic-level converter or a CMOS high-
sink-current driver.
The CD4049UB is the preferred hex buffer replacement for
the CD4009UBMS in all applications except multiplexers.
For applications not requiring high sink current or voltage
conversion, the CD4069UB Hex Inverter is recommended.
The CD4009UBMS is supplied in these 16 lead outline pack-
ages:
Braze Seal DIP H4S
Frit Seal DIP
H1E
Ceramic Flatpack H3X
Pinout
CD4009UBMS
TOP VIEW
VCC 1
G=A 2
A3
H=B 4
B5
I=C 6
C7
VSS 8
NC = NO CONNECTION
16 VDD
15 L = F
14 F
13 NC
12 K = E
11 E
10 J = D
9D
Features
• Inverting Type
• High-Voltage Type (20V Rating)
• 100% Tested for Quiescent Current at 20V
• Maximum Input Current of 1µA at 18V Over Full
Package-Temperature Range;
- 10nA at 18V and +25oC
• 5V, 10V and 15V Parametric Ratings
Applications
• CMOS To DTL/TTL Hex Converter
• CMOS Current “Sink” or “Source” Driver
• CMOS High-to-Low Logic-Level Converter
• Multiplexer - 1 to 6 or 6 to 1
Functional Diagram
3
A
2
G=A
5
B
4
H=B
NC
VCC
VSS
VDD
13
1
8
16
7
C
9
D
11
E
14
F
6
I=C
10
J=D
12
K=E
15
L=F
NC = NO CONNECTION
1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999


Intersil Electronic Components Datasheet

CD4009UBMS Datasheet

CMOS Hex Buffers/Converter

No Preview Available !

CD4009UBMS
Absolute Maximum Ratings
DC Supply Voltage Range, (VDD) . . . . . . . . . . . . . . . . -0.5V to +20V
(Voltage Referenced to VSS Terminals)
Input Voltage Range, All Inputs . . . . . . . . . . . . . -0.5V to VDD +0.5V
DC Input Current, Any One Input. . . . . . . . . . . . . . . . . . . . . . . . .±10mA
Operating Temperature Range . . . . . . . . . . . . . . . -55oC to +125oC
Package Types D, F, K, H
Storage Temperature Range (TSTG). . . . . . . . . . . -65oC to +150oC
Lead Temperature (During Soldering) . . . . . . . . . . . . . . . . . +265oC
At Distance 1/16 ± 1/32 Inch (1.59mm ± 0.79mm) from case for
10s Maximum
Reliability Information
Thermal Resistance. . . . . . . . . . . . . . . .
θja
Ceramic DIP and FRIT Package . . . . 80oC/W
θjc
20oC/W
Flatpack Package . . . . . . . . . . . . . . . . 70oC/W
20oC/W
Maximum Package Power Dissipation (PD) at +125oC
For TA = -55oC to +100oC (Package Type D, F, K) . . . . . .500mW
For TA = +100oC to +125oC (Package Type D, F, K) . . . . . Derate
Linearity at 12mW/oC to 200mW
Device Dissipation per Output Transistor. . . . . . . . . . . . . . . .100mW
For TA = Full Package Temperature Range (All Package Types)
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+175oC
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER
Supply Current
Input Leakage Current
Input Leakage Current
Output Voltage
Output Voltage
Output Current (Sink)
Output Current (Sink)
Output Current (Sink)
Output Current (Source)
Output Current (Source)
Output Current (Source)
Output Current (Source)
N Threshold Voltage
P Threshold Voltage
Functional
Input Voltage Low
(Note 2)
Input Voltage High
(Note 2)
Input Voltage Low
(Note 2)
Input Voltage High
(Note 2)
SYMBOL
CONDITIONS (NOTE 1)
IDD VDD = 20V, VIN = VDD or GND
VDD = 18V, VIN = VDD or GND
IIL VIN = VDD or GND VDD = 20
VDD = 18V
IIH VIN = VDD or GND VDD = 20
VOL15
VOH15
IOL5
IOL10
IOL15
IOH5A
IOH5B
IOH10
IOH15
VNTH
VPTH
F
VIL
VDD = 18V
VDD = 15V, No Load
VDD = 15V, No Load (Note 3)
VDD = 5V, VOUT = 0.4V
VDD = 10V, VOUT = 0.5V
VDD = 15V, VOUT = 1.5V
VDD = 5V, VOUT = 4.6V
VDD = 5V, VOUT = 2.5V
VDD = 10V, VOUT = 9.5V
VDD = 15V, VOUT = 13.5V
VDD = 10V, ISS = -10µA
VSS = 0V, IDD = 10µA
VDD = 2.8V, VIN = VDD or GND
VDD = 20V, VIN = VDD or GND
VDD = 18V, VIN = VDD or GND
VDD = 3V, VIN = VDD or GND
VDD = 5V, VOH > 4.5V, VOL < 0.5V
VIH VDD = 5V, VOH > 4.5V, VOL < 0.5V
VIL VDD = 15V, VOH > 13.5V,
VOL < 1.5V
VIH VDD = 15V, VOH > 13.5V,
VOL < 1.5V
GROUP A
SUBGROUPS
TEMPERATURE
LIMITS
MIN MAX UNITS
1
+25oC
- 2 µA
2
+125oC
- 200 µA
3
-55oC
- 2 µA
1
+25oC
-100
-
nA
2
+125oC
-1000 -
nA
3
-55oC
-100
-
nA
1
+25oC
- 100 nA
2
+125oC
- 1000 nA
3
-55oC
- 100 nA
1, 2, 3
+25oC, +125oC, -55oC -
50 mV
1, 2, 3
+25oC, +125oC, -55oC 14.95
-
V
1
+25oC
3.0 - mA
1
+25oC
8.0 - mA
1
+25oC
24.0 - mA
1
+25oC
- -0.2 mA
1
+25oC
- -0.8 mA
1
+25oC
- -0.45 mA
1
+25oC
- -1.5 mA
1
+25oC
-2.8 -0.7
V
1
+25oC
0.7 2.8
V
7
+25oC
VOH > VOL < V
7
+25oC
VDD/2 VDD/2
8A +125oC
8B -55oC
1, 2, 3
+25oC, +125oC, -55oC -
1.0 V
1, 2, 3
+25oC, +125oC, -55oC 4.0
-
V
1, 2, 3
+25oC, +125oC, -55oC -
2.5 V
1, 2, 3
+25oC, +125oC, -55oC 12.5
-
V
NOTES: 1. All voltages referenced to device GND, 100% testing being im- 3. For accuracy, voltage is measured differentially to VDD. Limit is
plemented.
0.050V max.
2. Go/No Go test with limits applied to inputs
2


Part Number CD4009UBMS
Description CMOS Hex Buffers/Converter
Maker Intersil Corporation
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CD4009UBMS Datasheet PDF






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